Small Scale Production Plasma-Enhanced Chemical Vapor Deposition System
SKU: PECVD-SS-VT
This system is used to deposit layers under high vacuum conditions on samples that are RF biased. It is a low temperature technique when compared to typical CVD process, which is a major advantage. Core System Features: • Base Pressure 1.10-6 mbar • Samples up to 300 mm • Inferior plate of 500 mm diameter with RF bias • Various Process gases (TMS, Hexane, CF4, O 2, Ar) • Pumping group (Suitable for corrosive gases) • Automated Control Applications: • Barrier Films • Insulators • Optical coatings • Biomedical Materials: • DLC • Doped/Undoped Amorphous Si • Dielectrics (Nitrides, Oxynitrides..) ...more