PVD-4+
PVD4 is a physical vapor deposition system, dedicated to the Evaporation or Sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of everyday applications, as its simplicity to use and its competitive price.
Turbo Pump nEXT300D
ISO100
Dry Scroll pump nXDS6i
WRG Wide Range Gauge (Pirani + Penning) measures from Patm to 10-9 mbar
APG100 Active Pirani Gauge measures from Patm to 10-3 mbar
Specifications
| Thickness Homogeneity (@ working distance of approx. 100 mm) | +/-3% |
| Thickness Reading Precision | 0.1 A |
| Deposition Rate Reading Precision | 0.01 A |
| Vacuum Base Pressure | 10-7 mbar or 10-8 mbar |
| Pumping-down Time (10-6 mbar) | < 20 mins |
| Turbo pump | From 300 l/s to 900 l/s vs N2 |
Core System Features
- Stainless steel – 400 mm diameter cylindrical
- Fast Entry Frontal Door with viewport
- Sample holder for substrates up to 6” in diameter
- Water cooling to avoid excess heating
- Compatible with Load Lock integration
- Compatible with clean room integration
-
Deposition Teqniques
THERMAL & EBEAM EVAPORATION
- Evaporation by joule effect and/or electron beam
- Up to 4 joule sources (boats, rods, baskets, filament,
crucibles) - Multi-pocket E-beam source
- Cross contamination shields included
MAGNETRON SPUTTERING
- 2” or 3” magnetron cathodes
- Integrated pneumatic shutters
- RF, DC or DC pulsed source power supplies
- Up to 4×2″ or 3 x 3″ cathodes in sputter up configuration
- Mass flow controller for gas line
- Pressure regulation by throttle valve or motorized
regulation valve
HYBRID CONFIGURATION
- Combined Sputtering & Evaporation processes
- Up to 4 evaporation sources & 2 x 2’’ sputtering
cathodes
Easy to Use Software
The R&D orientated system can be supplied with an easy-to-use automation
software for full control of any deposition process.
Process supervision software with:
- Rate deposition
- Thickness control
- Pressure display
- Temperature control
- Valve/Shutter management
Fully & Semi Automatic modes
User mode Access Levels
Recipe modes for Thickness Rate & Deposition Time
Safety management through a PLC:
- Interlock management for power supplies
- Automatic switching of the machine in safe mode
- Pressure, actuators and valves management
- First level securities management including Operator protection
Hardware :
Integrated PC with windows 10 connected to a PLC
Compatibility Matrix
| Configuration type | System | |||
|---|---|---|---|---|
| PVD-4 E | PVD-4 S | PVD-4 H* | PVD-4 EB | |
| SUBSTRATE HEATING (up to 600°C or 900°C) | ✓ | ✓ | ✓ | ✓ |
| SUBSTRATE TEMPERATURE CONTROL (40-70) FOR LIFTOFF | ✓ | ✓ | ✓ | ✓ |
| SUBSTRATE ROTATION | ✓ | ✓ | ✓ | ✓ |
| CATHODES (Up to 3) | – | ✓ | Max : 2 thermal sources + 2 cathodes | – |
| THERMAL (Up to 4 ) | ✓ | – | Max : 2 thermal sources + 2 cathodes | – |
| E- BEAM | – | – | – | |
| SECONDARY ELECTRON SUPPRESSION KIT | – | – | -✓ | |
| SAMPLE BIAS | – | ✓ | ✓ | ✓ |
| QUARTZ CONTROLLER | ✓ | ✓ | ✓ | ✓ |
| 2 OR 100 POSITIONS THROTTLE VALVE | – | ✓ | ✓ | – |
| MOTORIZED REGULATION VALVE | – | ✓ | ✓ | – |
Get In Touch Today
Get in touch today to discuss your requirements, please contact us on
+44 (0) 1424 447726 sales@ultrahighvacuum.com
Express delivery for the UK & Europe
Excellent customer care guaranteed
ISO 9001 approved company
Highest quality & performance assured