PVD20-S Physical Vapour (Sputtering) Deposition System
The PVD20-S is a physical vapor deposition system, dedicated to the sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of every day applications, as is, its simplicity to use and its competitive price.
Core System Features:
-D-shape steel – 500 mm diameter cylindrical
-Full access frontal Door with 2 viewports for easy
maintenance
-Sample holder for substrates up to 6” in diameter
-Rotating and heating (up to 350°C) substrate holder
-Water cooling to avoid excess heating
-Secured cryo pumping group (option)
-Loadlock (option)
-RF plasma pre-cleaning (option)
Sputtering Process:
-Up to 4 x 3-inch cathode magnetrons in Sputter Up configuration
-RF / DC power supply
-Process pressure : 10-3 – 10-1 mbar with a motorized throttle valve
-Up to 8 cathodes in sputter up configuration
-Gas panel for Ar, O2, N2
-Accurate control of deposition rates (crystal sensor)
Easy to Use Software
The R&D orientated system can be supplied with an easy to use automation software for full control of any deposition process.
Process supervision software with:
- Vacuum Display
- Process Pressure display
- Pressure display
- Temperature control
- Valve/Shutter management
Fully & Semi Automatic modes
Recipe modes with traceability
User mode Access Levels
Safety management through a PLC:
- Interlock management for power supplies
- Automatic switching of the machine in safe mode
- Pressure, actuators and valves management
- First level securities management
Hardware :
Integrated PC with windows 7 connected to a PLC
