PVD-4 Physical Vapor Deposition System
PVD-4 is a physical vapor deposition system, dedicated to the Evaporation or Sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of everyday applications, as its simplicity to use and its competitive price.
Deposition techniques include:
-Thermal & EBeam Evaporation
-Magnetron Sputtering
-Hybrid Configuration
-Organic Configuration
Core System Features:
-Stainless steel – 320 mm diameter cylindrical
-Fast Entry Frontal Door with viewport
-Sample holder for substrates up to 4” in diameter
-Water cooling to avoid excess heating
Easy to use software
The R&D orientated system can be supplied with an easy-to-use automation
software for full control of any deposition process.
Process supervision software with:
- Rate deposition
- Thickness control
- Pressure display
- Temperature control
- Valve/Shutter management
Fully & Semi Automatic modes
User mode Access Levels
Recipe modes for Thickness Rate & Deposition Time
Safety management through a PLC:
- Interlock management for power supplies
- Automatic switching of the machine in safe mode
- Pressure, actuators and valves management
- First level securities management including Operator protection
Hardware :
Integrated PC with windows 10 connected to a PLC
