Small Scale Production Plasma-Enhanced Chemical Vapor Deposition System
This system is used to deposit layers under high vacuum conditions on samples that are RF biased . It is a low temperature technique when compared to typical CVD process, which is a major advantage.
Core System Features:
*Base Pressure 1. 10 -6 mbar
*Samples up to 300 mm
*Inferior plate of 500 mm diameter with RF bias
*Various Process gases (TMS, Hexane, CF4, O 2, Ar)
*Pumping group (Suitable for corrosive gases)
*Automated Control
Applications:
*Barrier Films
*Insulators
*Optical coatings
*Biomedical
Materials:
*DLC
*Doped/Undoped AmorphousSi
*Dielectrics (Nitrides, Oxynitrides..)
Powerful Software
- Fully & Semi Automatic modes
- User mode Access Levels
Recipe modes for
- Thickness Rate & Deposition Time
- Pre-programmed recipe library
Process Acquisition software with:
- Rate deposition
- Thickness control
- Pressure Display
- Temperature Control
- Valve/Shutter management
Hardware
Integrated PC with Microsoft Windows
